IC Target
Omat Advanced Materialss integrated circuit targets cover high-purity sputtering targets for semiconductors such as copper Cu, aluminum Al, titanium Ti, tantalum Ta, and cobalt Co. The purity is ≥99.999%, the grain size is small and uniform, and the orientation consistency is high. It is widely used in wafer manufacturing, packaging, power semiconductors (IGBT, MOSFET), 5G filters, MEMS sensors, third-generation semiconductors (GaN, SiC), infrared optics, semiconductor display fields, etc.
Product List
6 products in total
High Purity Copper Target (Cu Target)
Omat copper targets offer outstanding advantages such as high purity, low oxygen content, and fine grain size.
Omat copper targets offer outstanding advantages such as high purity, low oxygen
High Purity Aluminum and Alloy Al/AlSi/AlCu/AlSiCu
High-purity aluminum and alloy sputtering targets for semiconductor chips; purity ≥5N5, average grain size ≤100 μm.
High-purity aluminum and alloy sputtering targets for semiconductor chips; purit
Titanium Target (Ti Target)
High-purity, high-density titanium sputtering target for semiconductor chip barrier layers
High-purity, high-density titanium sputtering target for semiconductor chip barr
Tantalum Target (Ta Target)
Tantalum sputtering target for copper-interconnect diffusion barrier layers in semiconductor chips
Tantalum sputtering target for copper-interconnect diffusion barrier layers in s
Cobalt Target (Co Target)
Cobalt sputtering target for semiconductor chip contact layers; suitable for advanced processes
Cobalt sputtering target for semiconductor chip contact layers; suitable for adv
Phosphorized Copper Anode
High-purity phosphorized copper anode material
High-purity phosphorized copper anode for integrated-circuit electroplating; uni
