High Purity Copper Target (Cu Target)

Omat copper targets offer outstanding advantages such as high purity, low oxygen content, and fine grain size.

High Purity Copper Target (Cu Target)

Product Introduction

Omat copper targets offer outstanding advantages such as high purity, low oxygen content, and fine grain size.

Specifications

Purity≥ 6N
Density8.96 g/cm³
Grain Sizeapprox. 30 μm (average)
Bonding MethodSB / DB / Mono
BPOFC, C18150, C18200, 6061
Bonding Rate≥ 99%
Oxygen Content≤ 1 ppm
Orientation[110] crystal plane, total XYZ ratio ≥ 50%
Surface Roughness≤ 0.4 μm
PackagingVacuum double-layer
High Purity Aluminum and Alloy Al/AlSi/AlCu/AlSiCu

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