High Purity Aluminum and Alloy Al/AlSi/AlCu/AlSiCu
High-purity aluminum and alloy sputtering targets for semiconductor chips; purity ≥5N5, average grain size ≤100 μm.
High-purity aluminum and alloy sputtering targets for semiconductor chips; purity ≥5N5, average grain size ≤100 μm.
| Purity | ≥ 5N5 |
| Density | 2.7 g/cm³ |
| Grain Size | average ≤ 100 μm |
| Bonding Method | EB / SB |
| BP | OFC, 6061 |
| Bonding Rate | ≥ 99% |
| Oxygen Content | ≤ 10 ppm |
| Orientation | Cubic texture dominant |
| Surface Roughness | ≤ 0.4 μm |
| Packaging | Vacuum double-layer |
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