Omat Advanced Materials Shines at WESEMBAY 2026, Winning the "Technological Innovation Enterprise · Materials Technology" Award
WESEMBAY 2026 Opens — Omat Advanced Materials Takes the Stage
On October 14, 2026, the 2026 Bay Area Semiconductor Industry Ecosystem Expo (WESEMBAY 2026) officially opened at the Shenzhen Convention & Exhibition Center (Futian). Themed "CHIP PILOTS THE FUTURE · AI INNOVATES THE ECOSYSTEM", the expo focused on wafer manufacturing, compound semiconductors, advanced packaging, IC design and other key fields, with a planned exhibition area of over 70,000 sqm and more than 1,000 semiconductor industry-chain companies from over 20 countries and regions.
Guangdong Omat Advanced Materials Co., Ltd. (Omat, stock code 688530) showcased its full range of high-end materials for the integrated circuit industry, and was named a "Technological Innovation Enterprise – Materials Technology" award winner at the concurrently held WESEMBAY 2026 Industry Innovation Achievement Exchange.
Four Product Lines on Display at Booth 1B10
Centered on the key material needs of the integrated circuit industry, Omat Advanced Materials presented a complete product matrix demonstrating the company’s technical depth and supply capability in high-end metal materials.
Sputtering Targets: 12-inch copper (monolithic), 12-inch copper, 12-inch copper-manganese, 12-inch titanium (monolithic), aluminum, cobalt, phosphor copper, tantalum and other high-purity metal targets.
Evaporation Materials: high-purity indium wire, high-purity indium foil, high-purity indium balls, liquid metal and tantalum pentoxide.
Compound Semiconductor Materials: featuring 7N ultra-high-purity indium ingots.
Components: alumina, zirconia, ceramic structural parts and ceramic tubes.
Named a "Technological Innovation Enterprise – Materials Technology" Award Winner
At the WESEMBAY 2026 Industry Innovation Achievement Exchange held alongside the expo, Omat Advanced Materials received the "Technological Innovation Enterprise – Materials Technology" award in recognition of its sustained technical investment and process breakthroughs in high-end materials for the integrated circuit industry.
The award honors enterprises with outstanding achievements in semiconductor materials technology innovation, marking broad industry recognition of Omat’s technical strength and innovation results in the semiconductor materials field.
Face-to-Face Exchanges on New Industry Opportunities
On the first day of the expo, the Omat booth drew dense footfall, with professional visitors from the equipment, materials and components sectors as well as media tour groups stopping by for consultations.
Materials as a Fulcrum, Moving Forward with "Chips"
The semiconductor industry is undergoing structural reshaping — key materials and core components have entered a critical period of validation and volume ramp-up.
Looking ahead, Omat Advanced Materials will keep increasing R&D investment and refine its product matrix around integrated circuits, compound semiconductors and advanced packaging, providing solid material support for supply-chain security, autonomy and controllability.
The excitement continues — see you at WESEMBAY 2026, October 14–16, Shenzhen Convention & Exhibition Center (Futian), Omat Booth 1B10.
