Omat Advanced Materials Showcases at IC China 2026 and Attends the New Product Launch Event

On November 12, the 23rd China International Semiconductor Expo (IC China 2026), co-hosted by the China Center for Information Industry Development and the China Semiconductor Industry Association, opened at the China National Convention Center in Beijing. As the most authoritative, professional and internationally influential full-industry-chain benchmark exhibition in China's semiconductor field, the expo showcases the latest technological achievements and future trends of the global semiconductor industry. Guangdong Omat Advanced Materials Co., Ltd. (Omat Advanced Materials, 688530.SH) presented its full range of high-end materials for the integrated circuit industry at the expo (Booth: T-080).

To bring innovations to target customers at the first opportunity, the expo simultaneously held a New Product Launch Event at the main venue of IC China, where cutting-edge domestic semiconductor technologies and innovative products were showcased. Omat Advanced Materials participated in the special session of the launch event, exchanging the latest R&D progress and industrialization directions of integrated circuit materials with industry peers.

At the New Product Launch Event of this expo, Li Tianzhu, Technical Manager of Omat Advanced Materials, attended the event on behalf of the company and exchanged views with participants on the latest technologies and industrialization progress in sputtering targets, compound semiconductor materials, components and other fields, further demonstrating the company's industry-chain positioning and full-chain layout in the integrated circuit industry.

At this expo, Omat Advanced Materials' booth number is T-080. We sincerely welcome industry colleagues and customer partners to visit our booth, get a close look at the series of high-end materials for integrated circuits, and explore innovative cooperation opportunities together.