Good News | Omat Copper Wins the "Data Center Best Thermal Management Material Supplier Award"

On September 22, the 2026 Yunfan 6th Shenzhen International AI Computing Power Liquid Cooling Supply Chain Technology Summit was held in Shenzhen. Focusing on AI computing power liquid cooling and green computing infrastructure, the summit brought together many enterprise representatives from across the industrial chain to jointly explore new directions for the computing power industry.

Guangdong Omat New Metal Materials Co., Ltd. (Omat Copper), leveraging its technical accumulation and product strength in high-purity metal materials for thermal management, won the "Data Center Best Thermal Management Material Supplier Award", earning high recognition from the industry.

On site, we held in-depth exchanges with many industry peers and exhibiting customers on the application of ultra-high-purity copper materials in intelligent computing data centers, chip thermal management, and other scenarios. We can stably produce ultra-high-purity oxygen-free copper with an oxygen content of ≤1 ppm, and supply customized products including copper tubes, copper rods, copper plates, copper bars, copper busbars, and special-shaped copper parts. We possess full-chain capabilities spanning purification and ingot casting, deformation processing, precision machining, and testing and analysis. Going forward, we will continue to refine thermal management materials suited to intelligent computing scenarios, strengthen industrial chain collaboration, and help advance the high-quality development of the data center liquid cooling and chip thermal management industries.