欧莱新材材料研究院

欧莱新材材料研究院共设立了6个市级、省部级科研平台和9个内设研发机构,拥有多名国内外具有先进行业经验的高端人才,研究课题涉及先进铜材料、靶材制备技术、半导体电子材料、薄膜技术、新能源材料(光伏电池、动力电池)、高纯金属、稀散金属、检测分析技术等领域,致力于打造产研用一体化的企业研发创新体系。

6个科研平台

市级、省部级科研平台

高端人才团队

国内外具有先进行业经验的高端人才

9个研发机构

内设研发机构,覆盖全产业链

核心研发设备

Magnetron Sputtering Coater

Core equipment for target sputtering verification, used in sputtering thin-film deposition process research.

Ultimate vacuum

≤5.0×10⁻⁶Pa

Sputtering power

DC/RF 500W

Substrate size

≤4 inch

Temp. range

RT-800°C

5,500-ton Dual-action Extruder

One of the largest dual-action copper extruders in the domestic industry, located at the Yuyuan production base, providing strong processing capacity for high-end copper alloy materials.

Rated pressure

5500 t

Container diameter

Φ280-420 mm

Extrusion ratio

up to 50:1

Product length

≤25 m

Large Hot Isostatic Press (HIP)

The largest hot isostatic press in South China, providing densification treatment for high-performance metals and frontier tech materials.

Max. temperature

1400°C

Max. pressure

200 MPa

Working zone

Φ500×1000 mm

Temp. uniformity

±5°C

Four-probe Resistivity Measurement System

Accurately measures thin-film conductivity, suitable for resistivity testing of targets, metal films and other materials.

Resistivity range

10⁻⁵~10⁵ Ω·cm

Sheet resistance

10⁻³~10⁶ Ω/□

Measurement accuracy

±0.5%

Probe spacing

1.0 mm

Bruker Stylus Profiler

Nano-scale surface precision inspection, used for film thickness, surface roughness and other morphology parameter measurements.

Vertical resolution

≤0.1 nm

Scan range

≤50 mm

Max. sample thickness

50 mm

Stage size

200×200 mm

Yellow-light Cleanroom

Semiconductor-grade clean environment equipped with lithography and development equipment, used for photolithography process R&D.

Cleanliness class

Class 1000

Lithography resolution

≤1 μm

Exposure area

≤6 inch

Overlay accuracy

≤0.3 μm

SEM Scanning Electron Microscope

Used for micro-morphology observation and composition analysis of materials, with resolution down to nanometer scale.

SE resolution

≤3.0 nm @30 kV

Magnification

7X~1,000,000X

Accelerating voltage

200 V~30 kV

EDS analysis

B-U elements

XRD X-Ray Diffractometer

Qualitative and quantitative phase analysis of materials, used for crystal structure characterization of targets, thin films and other materials.

Angle range

5°~140° (2θ)

Measurement accuracy

±0.01°

X-ray source

Cu Kα

Max. power

3 kW

ICP-OES Spectrometer

Inductively coupled plasma optical emission spectrometer, used for elemental content analysis in materials.

Wavelength range

167-852 nm

Analysis accuracy

ppm level

Detection limit

ppb level

Linear range

5-6 orders of magnitude

ONH Oxygen-Nitrogen-Hydrogen Analyzer

Accurately determines oxygen, nitrogen and hydrogen content in metal materials.

O detection range

0.05ppm~5.0%

N detection range

0.05ppm~3.0%

H detection range

0.1ppm~0.25%

Detection limit

0.025ppm(O)