Liquid Metal

Name: Liquid Metal
Brand: Omat Advanced Materials (Guangdong) Co., Ltd.

InGaAg/InGaSn alloys, low melting point, high thermal conductivity

Product Introduction

Liquid metal alloys (InGaAg, InGaSn) feature a low melting point, high fluidity, and high thermal conductivity, filling irregular surfaces to reduce contact thermal resistance. Used in CPU/GPU cooling (replacing thermal paste), flexible thermal interface materials (TIM), and heat pipes; spec 10–100 g gallium-indium, customizable, purity 4N5–7N.

Specifications

Composition	InGaAg, InGaSn
Purity	4N5–7N
Specification	갈륨-인듐 10g/20g/30g/40g/50g/100g, 맞춤
Density	6.44 g/cm³ (20 °C)
Melting Point	6–16 °C
Resistivity	3.46 × 10⁶ S/m
Core Applications	CPU/GPU 散热（替代硅脂）、柔性热界面材料(TIM)、热管