Indium Ball

Name: Indium Ball
Brand: Omat Advanced Materials (Guangdong) Co., Ltd.

Frontier feedstock for advanced packaging, φ1–3 mm

Product Introduction

Indium balls/beads are precision “micro-solder balls” enabling reliable chip-to-substrate interconnection, a frontier feedstock for advanced chip packaging micro-bumps and high-performance metal 3D printing. Purity 4N5–7N, specification φ1–3 mm near-spherical; capacity 2 t/year.

Specifications

Purity	4N5–7N (In ≥ 99.995%, 5N–7N 주문가능)
Specification	φ1 mm–3 mm 구형
Density	7.31 g/cm³
Melting Point	156.61 °C
Annual Capacity	2 吨/年
Core Applications	先进芯片封装微焊球、芯片与基板可靠连接、金属3D打印