High-purity microcrystalline phosphorus copper balls

Microcrystalline phosphorized copper ball is a high-performance electronic material with copper and phosphorus as main components, manufactured by precision processing with a microcrystalline structure. Its grain size is ≤60 μm, widely used in PCB high-end electronics manufacturing, semiconductor packaging, and new-energy vehicles.

Core characteristics

The grains of the microcrystalline phosphorized copper ball are fine and uniformly distributed (average grain size ≤60 μm), and grain refinement is achieved through large-deformation fine-grain and cold-heading processes, significantly improving density and uniformity.

Packaging specification

25 kg/box thickened carton with stretch-film protection, pallet transport (1 t/pallet).

Application fields

Semiconductor packaging: used in chip packaging to improve solder-joint reliability, suitable for HDI boards and IC substrates.

Printed circuit board (PCB): used in high-end PCB plating processes (e.g., rigid-flex boards), ensuring signal-transmission efficiency and reducing interference.

New-energy vehicles: applied in battery-management systems (BMS) and motor controllers, meeting high-efficiency conductivity and high-temperature-resistance needs.

Other fields: aerospace precision instruments, medical devices, 5G base stations, and other scenarios with stringent material-performance requirements.